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MINT! ANGSTROM EVOVAC DEPOSITION SYSTEM / THERMAL EVAPORATOR W/ VAC GLOVEBOXES
REF # (OC2189)
Contents
1 Announcements
2 Capabilities
3 System Overview 3.1 Hardware Details
3.2 Substrate Requirements
3.3 Material Restrictions
5 Standard Operating Procedure
6 Checkout Procedure
7 Maintenance 7.1 Tool Pumping Performance
7.2 Process Characterization
7.3 Power Bump Recovery
Announcements
6/15/18 Updated deposition tables and available films.
Needs detailed SOP – expect by Fall 2018
Multi-wafer lift-off evaporator Medium deposition rate (1-5 Å/sec) metal and dielectric films on multiple wafers
Designed for low heat transfer and minimal sidewall coverage for liftoff applications
Stacks of multiple films can be run
System Overview
Cryo-pumped box coater capable of low 10-7 Torr base pressure in 1 hr of pumping
Reactive gasses or heating up to 250C.
8x15cc pocket E-beam gun and 2 thermal sources to allow 10 different materials to be deposited in one run
Large distance from source and curved substrate dome designed for lift-off applications
Dome rotation and curved uniformity plate to allow for better uniformity
2”, 3”, 4” and 6” wafer holders available as well as clip fixtures for smaller pieces
Tool holds 4×4” or 4×6” wafers or 4×6″ fixtures.
- Dielectric##Aluminum Oxide
- ##Fused Silica
- ##Pyrex
- ##Silicon Oxide/Nitride/Poly (Clean thermal, LPCVD)
- ##Silicon Dioxide/Nitride (clean LTO)
- ##Silicon Dioxide (S6T1 dirty thermal)
- ##Silicon Dioxide (Sputtered)
- ##Silicon Oxide/Nitride/Amorphous (P5000)
- ##Silicon Oxide/Nitride (GSI)
- ##Silicon Oxide/Nitride/Amorphous (Plasmatherm)
- ##Titanium Dioxide
- ##Tantalum Oxide
- Semiconductor##Silicon
- ##In-situ doped Poly-Si (n type)
- ##In-situ doped Poly-Si (p type)
- ##Silicon Dioxide/Poly (Dirty LPCVD/LTO S6T3-4)
- ##Germanium
- ##Aluminum Nitride
- ##Gallium Oxide
- Metal##Chrome
- ##Nickel
- ##Nickel Chrome
- ##Gold
- ##Platinum
- ##Silver
- ##Tantalum
- ##Titanium
- ##Tungsten
- ##Tungsten/Titanium
- ##Aluminum
- ##Copper
- ##Iron
- ##Indium
- ##Iridium
- ##Moly
- ##Palladium
- ##Tin
- ##Zinc
- ##Indium Tin Oxide
- ##Zinc Oxide
- Polymer##KMPR
- ##PDMS
- ##Polyimide
- ##SPR 220
- ##SU-8
- ##PR – 1800
- ##PR 9260
- ##Parylene
Angstrom Engineering Films:
Material
- E-beam Pocket
- E-beam Max thickness
- E-beam Max Deposition Rate
- Thermal Max thickness
- Thermal Deposition Rate
- Titanium (Ti) 1 1 µm 10 Å/sec TBD TBD
- Chromium (Cr) 2 5000 Å 5 Å/sec N/A N/A
- Nickel Ni 3 5000 Å 5 Å/sec N/A N/A
- Gold (Au) 4 1 µm 7 Å/sec TBD TBD
- Aluminum (Al) 5 1 µm 10 Å/sec 2000 Å 2 Å/sec
- Platinum (Pt) 6 2000 Å 5 Å/sec N/A N/A
- Palladium Pd 6 5000 Å 5 Å/sec 200 Å 1 Å/sec
- Silver Ag 7 1 µm 10 Å/sec 2000 Å 2 Å/sec
- Copper Cu 7 or 8 1 µm 5 Å/sec 200 Å 1 Å/sec
- Tantalum Ta 7 5000 Å 3 Å/sec N/A N/A
- Molybdenum Mo 7 500 Å 1 Å/sec N/A N/A
- GermaniumGe 8 5000 Å 5 Å/sec N/A N/A
- Alumina Al2O3 8 2000 Å 5 Å/sec N/A N/A
- Silicon Dioxide SiO2 8 5000 Å 5 Å/sec N/A N/A
- Titanium Dioxide TiO2 7 or 8 5000 Å 5 Å/sec N/A N/A
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